Laser Depaneling – If Thinking About a PCB Punching Machine, Perhaps Peruse This Story.

BEST Inc. provides laser depaneling services for printed circuit board manufacturers and also EMS and OEMs. BEST’s numerous lasers are equipped to handle volumes from small prototype to large production runs. Laser depaneling can cut through plastics, ceramics and metals or some combination thereof. It is the right approach to use when there are sharp corners or many tight radii of curvature inside the PCB Router or even in the flex circuit.

Based on the material along with the part requirements, BEST laser services offers a tool-less part removal process by means of final perforation, scoring and hold-in tabs. By using a laser to execute the depaneling affords the user the benefit of speed and positional accuracy. Unlike mechanical methods there is not any part induced stresses, no tooling cost and no cutting oils or other contaminants.

rigid flex depanelizedIn addition BEST can be that provider of laser depanelization once you have a lot of IoT devices which should be precisely machined or cut out to fit perfectly directly into small mechanical enclosures.

Due to the contact-free processing that proceeds with Laser PCB Depanelizer of printed circuit boards, there is little distortion even if thin materials are employed. When boards are milled or punched out utilizing a mechanical tool there may show to be a loss precision and potentially a distortion within the outside board dimensions. Even worse it may well crack solder joints when using these mechanical means. In BEST laser depanelization system feature fiducial registration and web-based scaling, meaning already existing distortions might be compensated along with the cut contours positioned precisely in the layout.

Just like scoring or v-grooves, laser perforations are an alternative choice for singulated board removal from the panel or sheet. Perforations can be laser formed to any size and spacing to satisfy the required removal and securement forces.

Laser scoring can create a limited depth ablation line in the panelized boards. Most of the time the depth of the score line is 50% in the material thickness and will be controlled to some desired depth. The scoring acts inside a manner the same as the hold-tab to secure the part from the panel or sheet, but allows for individual 19dexjpky to become ‘snapped’ out after processing. Laser scoring lines can also be used like a deliberate path for crack propagation or stress relief. When performing the score lines like a service BEST either can take advantage of the IPC guidelines or follow customer requirements.

Hold-in tabs are small uncut sections around the board which are utilized to secure the PCB Punching Machine in the panel. The hold-in tabs are used for ease of handling small boards or even for printed circuit board securement for added processing. The hold-in tab width is chosen depending on the amount of force desired to remove the part through the panel/sheet or known forces to get applied by downstream processes like component loading. BEST laser services can make tabs in the majority of board materials as well as nearly any width and site about the part.